In this article, we’ll delve into China’s recent advancements in the semiconductor industry, as the country strives for self-reliance amidst the US containment.
The development of a unique chiplet interface is a significant step toward achieving this goal.
Key Takeaways:
China unveils an indigenous chiplet interconnect interface to boost self-reliance in the semiconductor sector.
The country’s semiconductor industry still has some catching up to do in comparison to international counterparts.
Collaboration is crucial for the development of a comprehensive chiplet ecosystem in China.
As China faces increasing isolation due to US-led technological containment, the nation has unveiled an innovative interconnect interface for chiplet technology.
This development comes as Moore’s Law edges closer to its physical limitations.
The China Chiplet League, a collaborative effort among China-based system integrators, IP providers, and packaging, testing, and assembly manufacturers, has introduced the Advanced Cost-driven Chiplet Interface 1.0 (ACC 1.0).
The goal of this new standard is to enhance coordination among Chinese suppliers in the packaging, testing, and assembly industries, as well as integrated circuit (IC) substrate manufacturers, in order to achieve cost control and business feasibility.
Despite recent advancements, the semiconductor ecosystem in China remains in a developmental stage.
The Institute for Interdisciplinary Information Core Technology, a China-based organization, has stressed that under current international circumstances, Chinese suppliers must collaborate to establish a comprehensive ecosystem.
This collaboration will enable a virtuous cycle in which downstream demand drives upstream investment, fostering economies of scale in mass production.
As Moore’s Law approaches its limits, chiplet technology has emerged as a promising alternative for advancing semiconductor manufacturing and packaging.
Chiplet technology enables modular design and assembly of microchips, resulting in improved flexibility, faster time-to-market, and reduced manufacturing costs.
Amidst containment efforts from the US and its allies, China’s semiconductor industry is keen on adopting chiplet technology to enhance chip performance.
Several big corporations such as Intel, TSMC, Microsoft, Samsung Electronics, Qualcomm, AMD, and ASE have teamed up to establish the Universal Chiplet Interconnect Express (UCIe) alliance, with the aim of advancing the chiplet industry worldwide.
According to Omdia, a research firm, the global chiplet market is expected to be worth $57 billion by the year 2035.
As the country accelerates its efforts toward semiconductor self-sufficiency, the China Chiplet League has introduced its domestic Chiplet Interconnect Interface Standard.
This new interface is designed to enable custom multi-chiplet designs developed by China-based companies and produced within the People’s Republic.
The China Chiplet League highlights how Chinese suppliers must work together along the entire supply chain to create a complete and integrated chiplet ecosystem.
China’s development of its indigenous chiplet interface marks a significant step toward achieving self-reliance in the semiconductor industry.
By fostering collaboration and innovation, the China Chiplet League aims to establish a robust chiplet ecosystem that can compete on the global stage.
As the nation continues to push forward in semiconductor technology, its progress will undoubtedly have a substantial impact on the global market.
